343 - 346 |
Dual-channel 4H-SiC metal semiconductor field effect transistors Zhu CL, Rusli, Zhao P |
347 - 353 |
Analytical threshold voltage model with TCAD simulation verification for design and evaluation of tri-gate MOSFETs Jin YW, Zeng C, Ma L, Barlage D |
354 - 359 |
Investigation of source-follower type analog buffer using low temperature poly-Si TFTs Chen BT, Tai YH, Wei YJ, Wei KF, Tsai CC, Huang CY, Kuo YJ, Cheng HC |
360 - 365 |
A unified circuit model for static and dynamic analyses of semiconductor optical amplifiers and laser diodes Jou JJ, Liu CK, Lee SL |
366 - 370 |
Surface roughness of silicon oxynitride etching in C2F6 inductively coupled plasma Kim B, Lee BT, Han JG |
371 - 375 |
Structural and electrical properties of metal-ferroelectric-insulator-semiconductor transistors using a Pt/Bi3.25Nd0.75Ti3O12/Y2O3/Si structure Tang MH, Zhou YC, Zheng XJ, Yan Z, Cheng CP, Ye Z, Hu ZS |
376 - 380 |
Optimal distance between current collecting electrodes of the solar cells Georgiev SS |
381 - 386 |
The influence of ohmic back contacts on the properties of a-Si : H Schottky diodes Ay I, Tolunay H |
387 - 393 |
A new analytical threshold voltage model for symmetrical double-gate MOSFETs with high-k gate dielectrics Chiang TK, Chen ML |
394 - 397 |
A novel high voltage LDMOS for HVIC with the multiple step shaped equipotential rings Chen WJ, Zhang B, Li ZJ, Liu Z |
398 - 404 |
Impact of graded channel (GC) design in fully depleted cylindrical/surrounding gate MOSFET (FD CGT/SGT) for improved short channel immunity and hot carrier reliability Kaur H, Kabra S, Bindra S, Haldar S, Gupta RS |
405 - 413 |
Integrated RF inductors with micro-patterned NiFe core Zhuang Y, Vroubel M, Rejaei B, Burghartz JN |
414 - 422 |
Analytical predictive modeling for the study of the scalability limits of multiple gate MOSFETs El-Hamid HA, Roig J, Iniguez B |
423 - 427 |
Fabrication and performance of optoelectronic devices with metal/diamond-like carbon Schottky contact Cheng X, Zhang MY, Chen XH, Chen C |
428 - 432 |
1-mm gate periphery AlGaN/AIN/GaN HEMTs on SiC with output power of 9.39 W at 8 GHz Wang XL, Cheng TS, Ma ZY, Hu G, Xiao HL, Ran JX, Wang CM, Luo WJ |
433 - 444 |
BSIM5: An advanced charge-based MOSFET model for nanoscale VLSI circuit simulation He J, Xi XM, Wan H, Dunga M, Chan M, Niknejad AM |
445 - 448 |
Influence of traps on charge transport in organic semiconductors Li L, Meller G, Kosina H |
449 - 459 |
Modelling and measurements of the parasitic electrostatic capacitances in Si/SiGe n-HFET Zerounian N, Enciso-Aguilar M, Hackbarth T, Herzog HJ, Aniel F |
460 - 465 |
Low resistivity ohmic contact to n-type poly-GaN using a Ti/Au/Ni/Au multilayer metal system Uen WY, Li ZY, Lan SM, Yang TN, Chen YW, Liao SM |
466 - 474 |
Transfer matrix method modelling of inhomogeneous Schottky barrier diodes on silicon carbide Furno M, Bonani F, Ghione G |
475 - 480 |
Trapping characteristics of lanthanum oxide gate dielectric film explored from temperature dependent current-voltage and capacitance-voltage measurements Sen B, Wong H, Molina J, Iwai H, Ng JA, Kakushima K, Sarkar CK |
481 - 488 |
Impact of intrinsic parameter fluctuations on the performance of HEMTs studied with a 3D parallel drift-diffusion simulator Seoane N, Garcia-Loureiro AJ, Kalna K, Asenov A |
489 - 492 |
Towards a silicon laser based on emissive structural defects Yukhnevich AV |
493 - 499 |
A new structure and its analytical model for the electric field and breakdown voltage of SOI high voltage device with variable-k dielectric buried layer Luo XR, Zhang B, Li ZJ |
500 - 504 |
Color tunable organic light emitting diodes using Eu complex doping Li WX, Hagen J, Jones R, Heikenfeld J, Steckl AJ |
505 - 510 |
Device design guidelines for nano-scale MuGFETs Lee CW, Yun SRN, Yu CG, Park JT, Colinge JP |
511 - 516 |
A comprehensive four parameters I-V model for GaAs MESFET output characteristics Memon NM, Ahmed MM, Rehman F |