| 849 - 881 |
Fatigue and failure behavior of silver-filled electronically-conductive adhesive joints subjected to elevated temperatures
Gomatam RR, Sancaktar E |
| 883 - 891 |
Metal deposition on liquid crystal polymers for molded interconnect devices using physical vapor deposition
Wang B, Eberhardt W, Kuck H |
| 893 - 904 |
Novel plate rheometer configuration allows monitoring real-time wood adhesive curing behavior
Witt M |
| 905 - 924 |
Effect of aliphatic isocyanates (HDI and LDI) as coupling agents on the properties of eco-composites from biodegradable polymers and corn starch
Ohkita T, Lee SH |
| 925 - 942 |
Adhesion of rubber compounds to nano-copper-coated iron plates as studied by AES depth profiles
Jeon GS, Jeong SW |
| 943 - 950 |
Nondestructive inspection of scuff-resistant coating adhesion flaws in automobile engine block cylinders
Bendada A |
| 951 - 966 |
Transport of organic solvents through coir-fiber-reinforced natural rubber composites: a method for evaluating interfacial interaction
Geethamma VG, Thomas S |
