검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Electrodeposited Cu Film Morphology on Thin PVD Cu Seed Layers Kelly J, Lin X, Nogami T, van der Straten O, Demarest J, Li J, Murphy R, Zhang X, Penny C, Parks C, Edelstein D Journal of the Electrochemical Society, 160(12), D3171, 2013 |
| 2 |
PVD Cu Reflow Seed Process Optimization for Defect Reduction in Nanoscale Cu/Low-k Dual Damascene Interconnects Motoyama K, van der Straten O, Maniscalco J, He M Journal of the Electrochemical Society, 160(12), D3211, 2013 |
| 3 |
Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects Kelly J, Nogami T, van der Straten O, Demarest J, Li J, Penny C, Vo T, Parks C, Dehaven P, Hu CK, Liniger E Journal of the Electrochemical Society, 159(10), D563, 2012 |
| 4 |
Zero Thickness Diffusion Barriers and Metallization Liners for Nanoscale Device Applications Kaloyeros AE, Eisenbraun ET, Dunn K, van der Straten O Chemical Engineering Communications, 198(11), 1453, 2011 |