검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Electrochemical analysis of zincate treatments for Al and Al alloy films Saito M, Maegawa T, Homma T Electrochimica Acta, 51(5), 1017, 2005 |
| 2 |
Intermetallic compound formation between Sn-3.5Ag solder and Ni-based metallization during liquid state reaction He M, Lau WH, Qi GJ, Chen Z Thin Solid Films, 462-63, 376, 2004 |
| 3 |
Characterizing metallurgical reaction of Sn-Pb solder with Ni/Cu under-bump metallization by electron microscopy Hsiao LY, Duh JG Thin Solid Films, 469-470, 366, 2004 |
| 4 |
Observation of amorphous chromium in modified C4 flip chip solder joints after thermal stress testing Hooghan TK, Nakahara S, Hooghan K, Privette RW, Bachman MA, Moyer RS Thin Solid Films, 437(1-2), 235, 2003 |