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| No. | Article |
|---|---|
| 1 |
An investigation of cure and thermal stability of poly(amide-amidic acid) modified tetraglycidyl 4,4-diaminodiphenylmethane/4,4-diaminodiphenylsulfone Chen HM, Lv RG, Liu P, Wang HY, Huang ZY, Huang T, Li TS Journal of Applied Polymer Science, 128(3), 1592, 2013 |