검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Assessment of Adhesion of Electroplated Cu and Multilayered Cu Coatings by a Bidirectional Bend Test Zhu YK, Yu ZM, Niu YS, Ding WJ Journal of Adhesion Science and Technology, 26(10-11), 1645, 2012 |
| No. | Article |
|---|---|
| 1 |
Assessment of Adhesion of Electroplated Cu and Multilayered Cu Coatings by a Bidirectional Bend Test Zhu YK, Yu ZM, Niu YS, Ding WJ Journal of Adhesion Science and Technology, 26(10-11), 1645, 2012 |