검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
The effect of aspect ratio scaling on hydrostatic stress in passivated interconnects Ang D, Wong CC, Ramanujan RV Thin Solid Films, 515(6), 3246, 2007 |
| 2 |
The effect of grain boundary characteristics on microstructure and stress void evolution in electroplated and sputtered Cu films Joo YC, Hwang SJ, Park H Materials Science Forum, 426-4, 3481, 2003 |
| 3 |
Evolution of surface morphologies in sputtered and electroplated Cu films during thermal cycling Hwang SJ, Park H, Lee JH, Oh KH, Joo YC Materials Science Forum, 408-4, 1651, 2002 |