1 |
Enhanced rate performance and high potential as well as decreased strain of LiNi0.6Co0.2Mn0.2O2 by facile fluorine modification Zhou S, Wang GX, Tang WJ, Xiao Y, Yan KP Electrochimica Acta, 261, 565, 2018 |
2 |
Development of a coaxial extrusion deposition for 3D printing of customizable pectin-based food simulant Vancauwenberghe V, Verboven P, Lammertyn J, Nicolai B Journal of Food Engineering, 225, 42, 2018 |
3 |
Enhanced electrochemical performance and decreased strain of graphite anode by Li2SiO3 and Li2CO3 co-modifying Xiao Y, Wang GX, Zhou S, Sun YH, Zhao Q, Gong YC, Lu TC, Luo CH, Yan KP Electrochimica Acta, 223, 8, 2017 |
4 |
Mathematical modeling of shrinkage deformation in eggplant undergoing simultaneous heat and mass transfer during convection-oven roasting Llave Y, Takemori K, Fukuoka M, Takemori T, Tomita H, Sakai N Journal of Food Engineering, 178, 124, 2016 |
5 |
Investigation on the Effect of Young's Modulus Variation on Drying-Induced Stresses Heydari M, Khalili K Transport in Porous Media, 112(2), 519, 2016 |
6 |
Temperature induced structural, electrical and optical changes in solution processed perovskite material: Application in photovoltaics Tripathi B, Bhatt P, Kanth PC, Yadav P, Desai B, Pandey MK, Kumar M Solar Energy Materials and Solar Cells, 132, 615, 2015 |
7 |
Selective epitaxial growth of compressively strained Ge layers on Si in 40-nm trench arrays Kim B, Kim SW, Jang H, Kim JH, Koo S, Kim DH, Min BG, Ko DH Thin Solid Films, 557, 55, 2014 |
8 |
Sin(2) psi analysis in thin films using 2D detectors: Non-linearity due to set-up, stress state and microstructure Faurie D, Geandier G, Renault PO, Le Bourhis E, Thiaudiere D Thin Solid Films, 530, 25, 2013 |
9 |
Investigation of the Mechanical Properties of Interphases in Adhesively Bonded Epoxy-Aluminum Joints by Localized Micro Extensometry Geiss PL, Schumann M Journal of Adhesion, 88(11-12), 941, 2012 |
10 |
The effect of nickel on the strain evolution in chemical copper films Bamberg S, Perry LK, Muir B, Abuzir A, Bruning F, Bruning R Thin Solid Films, 520(23), 6935, 2012 |