화학공학소재연구정보센터
검색결과 : 28건
No. Article
1 Damage and annealing recovery of boron-implanted ultra-shallow junction: The correlation between beam current and surface configuration
Chang FM, Wu ZZ, Lin YF, Kao LC, Wu CT, JangJian SK, Chen YN, Lo KY
Applied Surface Science, 433, 160, 2018
2 A study on NiGe-contacted Ge n(+)/p Ge shallow junction prepared by dopant segregation technique
Tsui BY, Shih JJ, Lin HC, Lin CY
Solid-State Electronics, 107, 40, 2015
3 Shallow junction characteristics due to low temperature BGe molecular ion implantation into silicon
Liang JH, Wu CH
Applied Surface Science, 310, 230, 2014
4 Improved subthreshold characteristics in tunnel field-effect transistors using shallow junction technologies
Chang HY, Chopra S, Adams B, Li JP, Sharma S, Kim Y, Moffatt S, Woo JCS
Solid-State Electronics, 80, 59, 2013
5 Study of ultra-shallow p(+)n junctions formed by excimer laser annealing
Juang MH, Lu CN, Jang SL, Cheng HC
Materials Chemistry and Physics, 123(1), 260, 2010
6 Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology
Nguyen ND, Rosseel E, Takeuchi S, Everaert JL, Yang L, Goossens J, Moussa A, Clarysse T, Richard O, Bender H, Zaima S, Sakai A, Loo R, Lin JC, Vandervorst W, Caymax M
Thin Solid Films, 518, S48, 2010
7 Effect of Si and He implantation in the formation of ultra shallow junctions in Si
Xu M, Regula G, Daineche R, Oliviero E, Hakim B, Ntsoenzok E, Pichaud B
Thin Solid Films, 518(9), 2354, 2010
8 Ultra-shallow junctions formed by quasi-epitaxial growth of boron and phosphorous-doped silicon films at 175 degrees C by rf-PECVD
Labrune M, Moreno M, Cabarrocas PRI
Thin Solid Films, 518(9), 2528, 2010
9 Formation of As enriched layer by steam oxidation of As+-implanted Si
Baghizadeh A, Agha-Aligol D, Fathy D, Lamehi-Rachti M, Moradi M
Applied Surface Science, 255(11), 5857, 2009
10 Transient activation model for antimony in relaxed and strained silicon
Lai Y, Bennett NS, Ahn C, Cowern NEB, Cordero N, Greer JC
Solid-State Electronics, 53(11), 1173, 2009