검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Characterization of reflow soldering at a peak temperature of 215 degrees C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball Hwang JH, Lee JH Applied Surface Science, 454, 227, 2018 |
| 2 |
Investigating heat transfer coefficient differences on printed circuit boards during vapour phase reflow soldering Geczy A International Journal of Heat and Mass Transfer, 109, 167, 2017 |
| 3 |
Numerical study of the gas flow velocity space in convection reflow oven Illes B, Bako I International Journal of Heat and Mass Transfer, 70, 185, 2014 |
| 4 |
Microscale self-assembly using molten alloys with different melting points Morris CJ, Dubey M Journal of Vacuum Science & Technology B, 26(6), 2534, 2008 |
| 5 |
Characteristics of ionic liquid-based electrolytes for chip type aluminum electrolytic capacitors Song Y, Zhu XF, Wang XL, Wang MJ Journal of Power Sources, 157(1), 610, 2006 |