| 1 |
Pyrolysis and utilization of nonmetal materials in waste printed circuit boards: Debromination pyrolysis, temperature-controlled condensation, and synthesis of oil-based resin
Gao RT, Xu ZM
Journal of Hazardous Materials, 364, 1, 2019 |
| 2 |
A large-scale statistical process control approach for the monitoring of electronic devices assemblage
Reis MS, Delgado P
Computers & Chemical Engineering, 39, 163, 2012 |
| 3 |
Plasma-printing and galvanic metallization hand in hand-A new technology for the cost-efficient manufacture of flexible printed circuits
Mobius A, Elbick D, Weidlich ER, Feldmann K, Schuessler F, Borris J, Thomas M, Zanker A, Klages CP
Electrochimica Acta, 54(9), 2473, 2009 |
| 4 |
Characterization of the Conduction Mechanisms in Adsorbed Electrolyte Layers on Electronic Boards Using AC Impedance
Zou LC, Hunt C
Journal of the Electrochemical Society, 156(1), C8, 2009 |
| 5 |
Modeling Strategy for Predicting Current Density Distributions on PCBs and Other Complex Patterned Substrates
Raffelstetter P, Mollay B, Van den Bossche B, Nauer GE
Journal of the Electrochemical Society, 156(2), D51, 2009 |
| 6 |
Microvia Filling by Cu Electroplating Over a Au Seed Layer Modified by a Disulfide
Dow WP, Chiu YD, Yen MY
Journal of the Electrochemical Society, 156(4), D155, 2009 |
| 7 |
Surface Metallization on High Temperature Liquid-Crystal-Polymer Film by UV-Irradiation Process
Sugiyama T, Iimori Y, Baba K, Watanabe M, Honma H
Journal of the Electrochemical Society, 156(9), D360, 2009 |
| 8 |
Morphologies and properties of cured epoxy/brominated-phenoxy blends
Yokoyama N, Nonaka Y, Kurata T, Sakai S, Takahashi S, Kasemura T
Journal of Applied Polymer Science, 104(3), 1702, 2007 |
