검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
On the role of halides and thiols in additive-assisted copper electroplating Huynh TMT, Weiss F, Hai NTM, Reckien W, Bredow T, Fluegel A, Arnold M, Mayer D, Keller H, Broekmann P Electrochimica Acta, 89, 537, 2013 |
| 2 |
Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating Hai NTM, Kramer KW, Fluegel A, Arnold M, Mayer D, Broekmann P Electrochimica Acta, 83, 367, 2012 |
| 3 |
Copper electrodeposition from a pH 3 sulfate electrolyte Vicenzo A, Cavallotti PL Journal of Applied Electrochemistry, 32(7), 743, 2002 |
| 4 |
Effects of additives and chelating agents on electroless copper plating Lin YM, Yen SC Applied Surface Science, 178(1-4), 116, 2001 |