검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Tetrazole Derived Levelers for Filling Electroplated Cu Microvias: Electrochemical Behaviors and Quantum Calculations Lei ZW, Chen L, Wang WL, Wang ZL, Zhao C Electrochimica Acta, 178, 546, 2015 |
| 2 |
An effective triblock copolymer as a suppressor for microvia filling via copper electrodeposition Xiao N, Li DY, Cui GF, Li N, Tian D, Li Q, Wu G Electrochimica Acta, 109, 226, 2013 |
| 3 |
Microvia filling by copper electroplating using diazine black as a leveler Dow WP, Li CC, Su YC, Shen SP, Huang CC, Lee C, Hsu B, Hsu S Electrochimica Acta, 54(24), 5894, 2009 |
| 4 |
Enhancement of filling performance of a copper plating formula at low chloride concentration Dow WP, Yen MY, Liu CW, Huang CC Electrochimica Acta, 53(10), 3610, 2008 |
| 5 |
Filling mechanism in microvia metallization by copper electroplating Dow WP, Yen MY, Liao SZ, Chiu YD, Huang HC Electrochimica Acta, 53(28), 8228, 2008 |