검색결과 : 38건
| No. | Article |
|---|---|
| 1 |
Selective reduction of an Australian garnieritic laterite ore Yang J, Zhang GQ, Ostrovski O, Jahanshahi S Minerals Engineering, 131, 79, 2019 |
| 2 |
Towards a more reliable manufacturing future - Automatic classification of failure modes during adhesion testing of silicon solar cells Phua B, Hsiao PC, Wang X, Lennon A Solar Energy, 178, 61, 2019 |
| 3 |
Impact of contact integrity during thermal stress testing on degradation analysis of copper-plated silicon solar cells Colwell J, Hsiao PC, Shen XW, Zhang W, Wang X, Lim S, Lennon A Solar Energy Materials and Solar Cells, 174, 225, 2018 |
| 4 |
Fine front side metallisation by stretching the dispensed silver paste filament with graphite nanofibres Kunpai C, Kang MG, Song HE, Shin DY Solar Energy Materials and Solar Cells, 169, 167, 2017 |
| 5 |
Numerical modelling and experimental validation of a low concentrating photovoltaic system Baig H, Sarmah N, Heasman KC, Mallick TK Solar Energy Materials and Solar Cells, 113, 201, 2013 |
| 6 |
A HfO2 Thin Film Resistive Switch Based on Conducting Atomic Force Microscopy Son JY, Kim DY, Kim H, Maeng WJ, Shin YS, Shin YH Electrochemical and Solid State Letters, 14(8), H311, 2011 |
| 7 |
Progress in the metallisation of n-type multicrystalline silicon solar cells Silva JA, Gauthier M, Boulord C, Oliver C, Kaminski A, Semmache B, Lemiti M Solar Energy Materials and Solar Cells, 95(12), 3333, 2011 |
| 8 |
Selective and Anisotropic Copper Electroplating Using Copper Overburden with an Inhibiting Additive Haba T, Suzuki H, Yoshida H, Akahoshi H, Chinda A Electrochemical and Solid State Letters, 13(5), D23, 2010 |
| 9 |
Thin Cu Film Deposition by Operation of Nanosilicon Ballistic Electron Emitter in Solution Ohta T, Gelloz B, Koshida N Electrochemical and Solid State Letters, 13(10), D73, 2010 |
| 10 |
Ultrathin Diffusion Barrier for Copper Metallization: A Thermally Stable Amorphous Rare-Earth Scandate Chu JP, Yu TY, Wu CH, Lin CH, Wang SF, Chen Q Journal of the Electrochemical Society, 157(3), H384, 2010 |