| 1 |
Adaptive virtual metrology for semiconductor chemical mechanical planarization process using GMDH-type polynomial neural networks
Jia XD, Di Y, Feng JS, Yang QB, Dai HH, Lee J
Journal of Process Control, 62, 44, 2018 |
| 2 |
Investigation of cu-BTA complex formation during Cu chemical mechanical planarization process
Cho BJ, Shima S, Hamada S, Park JG
Applied Surface Science, 384, 505, 2016 |
| 3 |
Preparation of spherical ceria coated silica nanoparticle abrasives for CMP application
Peedikakkandy L, Kalita L, Kavle P, Kadam A, Gujar V, Arcot M, Bhargava P
Applied Surface Science, 357, 1306, 2015 |
| 4 |
Synergetic effect of organic cores and inorganic shells for core/shell structured composite abrasives for chemical mechanical planarization
Chen Y, Li ZN, Miao NM
Applied Surface Science, 314, 180, 2014 |
| 5 |
Benzotriazole as a passivating agent during chemical mechanical planarization of Ni-P alloy substrates
Mu Y, Zhong MJ, Rushing KJ, Li YZ, Shipp DA
Applied Surface Science, 315, 190, 2014 |
| 6 |
Effects of chemical mechanical planarization slurry additives on the agglomeration of alumina nanoparticles II: Aggregation rate analysis
Brahma N, Talbot JB
Journal of Colloid and Interface Science, 419, 25, 2014 |
| 7 |
Effects of CMP slurry additives on the agglomeration of alumina nanoparticles 1: General aggregation rate behavior
Brahma N, Talbot JB
Journal of Colloid and Interface Science, 419, 56, 2014 |
| 8 |
Endpoint detection of Ge2Sb2Te5 during chemical mechanical planarization
He AD, Liu B, Song ZT, Liu WL, Lu YG, Wang LY, Wu GP, Feng SL
Applied Surface Science, 283, 304, 2013 |
| 9 |
Extended study of the atomic step-terrace structure on hexagonal SiC (0001) by chemical-mechanical planarization
Shi XL, Pan GS, Zhou Y, Zou CL, Gong H
Applied Surface Science, 284, 195, 2013 |
| 10 |
Effect of slurry aging on stability and performance of chemical mechanical planarization process
Basim GB
Advanced Powder Technology, 22(2), 257, 2011 |
