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Layer formation mechanism of K-feldspar in bubbling fluidized bed combustion of phosphorus-lean and phosphorus-rich residual biomass Wagner K, Haggstrom G, Skoglund N, Priscak J, Kuba M, Ohman M, Hofbauer H Applied Energy, 248, 545, 2019 |
2 |
Microstructural array and solute content affecting electrochemical behavior of Sn-Ag and Sn-Bi alloys compared with a traditional Sn-Pb alloy Satizabal LM, Costa D, Moraes PB, Bortolozo AD, Osorio WR Materials Chemistry and Physics, 223, 410, 2019 |
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Apparent kinetics of the water-gas-shift reaction in biomass gasification using ash-layered olivine as catalyst Kryca J, Priscak J, Lojewska J, Kuba M, Hofbauer H Chemical Engineering Journal, 346, 113, 2018 |
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Aspects of the practical application of titanium alloys after low temperature nitriding glow discharge in hydrogen- free -gas media Mashovets NS, Pastukh IM, Voloshko SM Applied Surface Science, 392, 356, 2017 |
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Characterization of the protective layer formed on zinc in whole blood Torne KB, Ornberg A, Weissenrieder J Electrochimica Acta, 258, 1476, 2017 |
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Experimental investigation of cavitating structures in the near wake of a cylinder Kumar P, Chatterjee D, Bakshi S International Journal of Multiphase Flow, 89, 207, 2017 |
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Impact of the fouling mechanism on enzymatic depolymerization of xylan in different configurations of membrane reactors Sueb MSM, Luo JQ, Meyer AS, Jorgensen H, Pinelo M Separation and Purification Technology, 178, 154, 2017 |
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Critical review on sputter-deposited Cu2ZnSnS4 (CZTS) based thin film photovoltaic technology focusing on device architecture and absorber quality on the solar cells performance Zhuk S, Kushwaha A, Wong TKS, Masudy-Panah S, Smirnov A, Dalapati GK Solar Energy Materials and Solar Cells, 171, 239, 2017 |
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Minimizing Artifacts in Three-electrode Double Layer Capacitance Measurements Caused by Stray Capacitances Balabajew M, Roling B Electrochimica Acta, 176, 907, 2015 |
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Fouling mechanisms of gel layer in a submerged membrane bioreactor Hong HC, Zhang MJ, He YM, Chen JR, Lin HJ Bioresource Technology, 166, 295, 2014 |