| 1 |
Inkjet Printing of SiO2 Hollow Spheres/Polyimide Hybrid Films for Foldable Low-k ILD
Kim MK, Hwang SH, Jung HS, Oh TS, Kim JH, Yoo JB
Macromolecular Research, 26(12), 1123, 2018 |
| 2 |
Mechanistic study on interlayer dielectric breakdown in integrated circuits
Wang P
Materials Chemistry and Physics, 128(3), 323, 2011 |
| 3 |
Plasma-enhanced chemical vapor deposition of carbon films using dibromoadamantane
Shirafuji T, Nishimura Y, Tachibana K, Ishii H
Thin Solid Films, 518(3), 993, 2009 |
| 4 |
Design of diffusion barriers
Gill WN, Plawsky JL
Thin Solid Films, 515(11), 4794, 2007 |
| 5 |
Comparisons on doping of different alkyl compound on SiO2 to form a low-k dielectric material
Lim AYK, Ibrahim K
Materials Science Forum, 480, 213, 2005 |
| 6 |
Application of SiO2 aerogel film for interlayer dielectric on GaAs with a barrier of Si3N4
Jung SB, Park SW, Yang JK, Park HH, Kim H
Thin Solid Films, 447, 580, 2004 |
| 7 |
Low Dielectric Constant of MeV Ion-Implanted Poly(vinylidene fluoride)
Lee SY, Kim BH, Park SK, Joo J, Beag YW, Koh SK
Macromolecular Research, 11(1), 9, 2003 |
| 8 |
Temperature studies of optical birefringence and X-ray diffraction with poly(p-xylylene), poly(chloro-p-xylylene) and poly(tetrafluoro-p-xylylene) CVD thin films
Senkevich JJ, Desu SB, Simkovic V
Polymer, 41(7), 2379, 2000 |
