검색결과 : 26건
| No. | Article |
|---|---|
| 1 |
Module Level Electronic Circuit Based PV Array for Identification and Reconfiguration of Bypass Modules Murtaza AF, Sher HA, Al-Haddad K, Spertino F IEEE Transactions on Energy Conversion, 36(1), 380, 2021 |
| 2 |
Selective Chemical Vapor Deposition-Grown Ru for Cu Interconnect Capping Applications Yang CC, McFeely FR, Wang PC, Chanda K, Edelstein DC Electrochemical and Solid State Letters, 13(5), D33, 2010 |
| 3 |
Effect of Surface Reduction Treatments of Plasma-Enhanced Atomic Layer Chemical Vapor Deposited TaNx on Adhesion with Copper Chang CC, Pan FM, Chen CW Journal of the Electrochemical Society, 157(2), G62, 2010 |
| 4 |
1H-Benzotriazole Incorporated Pad for Chemical Mechanical Planarization of Copper Yu JF, Jia DM, Venkataraman SS, Li YZ Journal of the Electrochemical Society, 157(3), H312, 2010 |
| 5 |
Precision laser micromachining of trenches in GaN on sapphire Mak GY, Lam EY, Choi HW Journal of Vacuum Science & Technology B, 28(2), 380, 2010 |
| 6 |
Silicon on insulator nanoscale backside interconnects for atomic and molecular scale circuits Lwin MHT, Tun TN, Kim HH, Kajen RS, Chandrasekhar N, Joachim C Journal of Vacuum Science & Technology B, 28(5), 978, 2010 |
| 7 |
Accelerated Superfilling Behavior and Suppressed Agglomeration of CEMOCVD Cu Film Using In Situ Plasma Treatment Pyo SG, Kim S Electrochemical and Solid State Letters, 12(1), H14, 2009 |
| 8 |
Suppressor Effects during Copper Superfilling of Sub-100 nm Lines Huang Q, Baker-O'Neal BC, Kelly JJ, Broekmann P, Wirth A, Emnet C, Martin M, Hahn M, Wagner A, Mayer D Electrochemical and Solid State Letters, 12(4), D27, 2009 |
| 9 |
Low Temperature Wafer Bonding by Copper Nanorod Array Wang PI, Lee SH, Parker TC, Frey MD, Karabacak T, Lu JQ, Lu TM Electrochemical and Solid State Letters, 12(4), H138, 2009 |
| 10 |
Local-Topography-Induced Defects during Tungsten Chemical Mechanical Polishing and Their Impact on Back End of Line Yu H, Wang XB, Sheng HF, Lu W, Zhou MS Journal of the Electrochemical Society, 156(1), H64, 2009 |