검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Stabilized copper plating method by programmed electroplated current: Accumulation of densely packed copper grains in the interconnect Kao LC, Hsu LH, Brahma S, Huang BC, Liu CC, Lo KY Applied Surface Science, 388, 228, 2016 |
| 2 |
Formation mechanism of pinholes in electroplated Cu films and its mitigation Chen CC, Hsieh CH, Lee YW, Yang CH, Ho CE Thin Solid Films, 596, 209, 2015 |
| 3 |
Development and evaluation of a Cu composite sheet with embedded high electric conduction path for new interconnect material Shin JS, Moon HK, Kim BH, Kim KH, Lee HS, Jung SB, Kwon HC Current Applied Physics, 11(1), S283, 2011 |
| 4 |
Effect of Ag-alloying addition on the stress-temperature behavior of electroplated copper thin films Menzel S, Strehle S, Wendrock H, Wetzig K Applied Surface Science, 252(1), 211, 2005 |
| 5 |
Ni/Cu metallization for low-cost high-efficiency PERC cells Lee EJ, Kim DS, Lee SH Solar Energy Materials and Solar Cells, 74(1-4), 65, 2002 |