검색결과 : 12건
| No. | Article |
|---|---|
| 1 |
Spin-coatable HfO2 resist for optical and electron beam lithographies Saifullah MSM, Khan MZR, Hasko DG, Leong ESP, Neo XL, Goh ETL, Anderson D, Jones GAC, Welland ME Journal of Vacuum Science & Technology B, 28(1), 90, 2010 |
| 2 |
Enhanced resolution of poly(methyl methacrylate) electron resist by thermal processing Arjmandi N, Lagae L, Borghs G Journal of Vacuum Science & Technology B, 27(4), 1915, 2009 |
| 3 |
Method for improving the aspect ratio of ultrahigh-resolution structures in negative electron-beam resist Sidorkin VA, Alkemade PFA, Salemink HWM, Schmits R, van der Drift E Journal of Vacuum Science & Technology B, 27(6), 2503, 2009 |
| 4 |
Study on line edge roughness for electron beam acceleration voltages from 50 to 5 kV Rio D, Constancias C, Saied M, Icard B, Pain L Journal of Vacuum Science & Technology B, 27(6), 2512, 2009 |
| 5 |
Self-powered near field electron lithography Lu YR, Yoshimizu N, Lal A Journal of Vacuum Science & Technology B, 27(6), 2537, 2009 |
| 6 |
Understanding of hydrogen silsesquioxane electron resist for sub-5-nm-half-pitch lithography Yang JKW, Cord B, Duan HG, Berggren KK, Klingfus J, Nam SW, Kim KB, Rooks MJ Journal of Vacuum Science & Technology B, 27(6), 2622, 2009 |
| 7 |
Contrast enhancement behavior of hydrogen silsesquioxane in a salty developer Nam SW, Rooks MJ, Yang JKW, Berggren KK, Kim HM, Lee MH, Kim KB, Sim JH, Yoon DY Journal of Vacuum Science & Technology B, 27(6), 2635, 2009 |
| 8 |
Fabrication of nanodot array molds by using an inorganic electron-beam resist and a postexposure bake Manabe T, Taniguchi J, Ishikawa K Journal of Vacuum Science & Technology B, 27(6), 2832, 2009 |
| 9 |
Sub-15 nm nanoimprint molds and pattern transfer Morecroft D, Yang JKW, Schuster S, Berggren KK, Xia QF, Wu W, Williams RS Journal of Vacuum Science & Technology B, 27(6), 2837, 2009 |
| 10 |
The effect of thin metal overlayers on the electron beam exposure of polymethyl methacrylate Samantaray CB, Hastings JT Journal of Vacuum Science & Technology B, 26(6), 2300, 2008 |