| 1 |
Quantitative assessment of flow and electric fields for electrophoretic focusing at a converging channel entrance with interfacial electrode
Keebaugh MW, Mahanti P, Hayes MA
Electrophoresis, 33(13), 1924, 2012 |
| 2 |
Citric Acid and NaIO4 Based Alkaline Cleaning Solution for Particle Removal during Post-Ru CMP Cleaning
Kim IK, Prasad YN, Kwon TY, Kim HM, Busnaina AA, Park JG
Journal of the Electrochemical Society, 158(10), H1052, 2011 |
| 3 |
Effect of Hydroxyethyl Cellulose Concentration on Surface Qualities of Silicon Wafer after Touch Polishing Process
Hwang HS, Lim JH, Park JH, Choi ES, Ahn JW, Park JG
Electrochemical and Solid State Letters, 13(5), H147, 2010 |
| 4 |
Effects of Surface Forces on Material Removal Rate in Chemical Mechanical Planarization
Bozkaya D, Muftu S
Journal of the Electrochemical Society, 157(3), H287, 2010 |
| 5 |
Using Poly(4-Styrene Sulfonic Acid) to Improve the Dispersion Homogeneity of Aqueous-Processed LiFePO4 Cathodes
Li CC, Peng XW, Lee JT, Wang FM
Journal of the Electrochemical Society, 157(4), A517, 2010 |
| 6 |
Advanced Use of Nanobismuth/Nafion Electrode for Trace Analyses of Zinc, Cadmium, and Lead
Lee GJ, Kim CK, Lee MK, Rhee CK
Journal of the Electrochemical Society, 157(7), J241, 2010 |
| 7 |
Method for Quantifying the Degree of Agglomeration in Highly Stable Chemical Mechanical Polishing Slurries
Chang FC, Singh RK
Electrochemical and Solid State Letters, 12(4), H127, 2009 |
| 8 |
Facile Electrophoretic Deposition of Ni-Decorated Carbon Nanotube Film for Electrochemical Capacitors
Wu MS, Huang CY, Lin KH
Electrochemical and Solid State Letters, 12(7), A129, 2009 |
| 9 |
Selective Polishing of Polysilicon during Fabrication of Microelectromechanical Systems Devices
Veera PRD, Natarajan A, Hegde S, Babu SV
Journal of the Electrochemical Society, 156(6), H487, 2009 |
| 10 |
Formulation and characterization of doxorubicin nanovesicles
Honary S, Ebrahimi P, Tabbakhian M, Zahir F
Journal of Vacuum Science & Technology B, 27(3), 1573, 2009 |
