검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
A fundamental modeling approach for nano-grinding of silicon wafers Young HT, Huang HY, Yang YJ Materials Science Forum, 505-507, 253, 2006 |
| 2 |
Decohesion of a rigid punch from an elastic layer: Transition from "flaw sensitive" to "flaw insensitive" regime Tang T, Hui CY Journal of Polymer Science Part B: Polymer Physics, 43(24), 3628, 2005 |