검색결과 : 1건
No. | Article |
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1 |
Preoxidation of the Cu layer in direct bonding technology Ning HL, Ma JS, Huang FX, Wang YG, Li QQ, Li XY Applied Surface Science, 211(1-4), 250, 2003 |
No. | Article |
---|---|
1 |
Preoxidation of the Cu layer in direct bonding technology Ning HL, Ma JS, Huang FX, Wang YG, Li QQ, Li XY Applied Surface Science, 211(1-4), 250, 2003 |