| 1 |
Two-dimensional Organic Materials and Their Electronic Applications
Wang HY, Wang QJ, Li Y
Chemistry Letters, 48(1), 14, 2019 |
| 2 |
Measurement of effective carrier lifetime at the semiconductor-dielectric interface by Photoconductive Decay (PCD) Method
Drummond PJ, Bhatia D, Ruzyllo J
Solid-State Electronics, 81, 130, 2013 |
| 3 |
Peculiarities of thin film deposition by means of reactive impulse plasma assisted chemical vapor deposition (RIPACVD) method
Werbowy A, Olszyna A, Zdunek K, Sokolowska A, Szmidt J, Barcz A
Thin Solid Films, 459(1-2), 160, 2004 |
| 4 |
Advantages and limitations of MgO as a dielectric for GaN
Gila BP, Kim J, Luo B, Onstine A, Johnson W, Ren F, Abernathy CR, Pearton SJ
Solid-State Electronics, 47(12), 2139, 2003 |
| 5 |
Development of plasma dielectric deposition method for increased pre-metal dielectric interfacial film stability
Lobbins JM, Pearton SJ, Ren F
Solid-State Electronics, 46(9), 1367, 2002 |
| 6 |
SiC devices with ONO stacked dielectrics
Lipkin LA, Palmour JW
Materials Science Forum, 338-3, 1093, 2000 |
