검색결과 : 4건
No. | Article |
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1 |
Thermal Properties of New Bismaleimide Resins Containing Hydrogen Silsesquioxane and Diallyl Bisphenol A Huang FW, Huang FR, Zhou Y, Du L Journal of Applied Polymer Science, 117(5), 2932, 2010 |
2 |
Catalytic effect of 2,2'-diallyl bisphenol a on thermal curing of cyanate esters Koh HCY, Dai J, Tan E, Liang WR Journal of Applied Polymer Science, 101(3), 1775, 2006 |
3 |
Effect of organoclay on the curing reactions in bismaleimide/diallyl bisphenol a resin Hu X, Meng JR Journal of Polymer Science Part A: Polymer Chemistry, 43(5), 994, 2005 |
4 |
Bismaleimide resin modified with diallyl bisphenol A and diallyl p-phenyl diamine for resin transfer molding Li ZM, Yang MB, Huang R, Zhang MD, Feng IM Journal of Applied Polymer Science, 80(12), 2245, 2001 |