검색결과 : 1건
No. | Article |
---|---|
1 |
Subcritical delamination in epoxy bonds to silicon and glass adherends: Effect of temperature and preconditioning Singh HK, Wan KT, Dillard JG, Dillard DA, Reboa P, Smith J, Chappell E, Sharan A Journal of Adhesion, 84(7), 619, 2008 |