검색결과 : 11건
| No. | Article |
|---|---|
| 1 |
Towards Structural Analysis of Polymeric Contaminants in Electrodeposited Cu films Moreno-Garcia P, Grimaudo V, Riedo A, Tulej M, Neuland MB, Wurz P, Broekmann P Electrochimica Acta, 199, 394, 2016 |
| 2 |
중성 영역 구리 화학적 기계적 평탄화 공정에서의 작용기에 따른 부식방지제의 영향성 연구 이상원, 김재정 Korean Chemical Engineering Research, 53(4), 517, 2015 |
| 3 |
The Effect of Polyether Suppressors on the Nucleation and Growth of Copper on RuTa Seeded Substrate for Direct Copper Plating Nagar M, Radisic A, Strubbe K, Vereecken PM Electrochimica Acta, 127, 315, 2014 |
| 4 |
반도체 소자용 구리 배선 형성을 위한 전해 도금 김명준, 김재정 Korean Chemical Engineering Research, 52(1), 26, 2014 |
| 5 |
Competitive anion/anion interactions on copper surfaces relevant for Damascene electroplating Hai NTM, Huynh TTM, Fluegel A, Arnold M, Mayer D, Reckien W, Bredow T, Broekmann P Electrochimica Acta, 70, 286, 2012 |
| 6 |
Classification of suppressor additives based on synergistic and antagonistic ensemble effects Broekmann P, Fluegel A, Emnet C, Arnold M, Roeger-Goepfert C, Wagner A, Hai NTM, Mayer D Electrochimica Acta, 56(13), 4724, 2011 |
| 7 |
A modified Damascene electrodeposition process for bottom-up filling of recessed surface features Lee CH, Moffat TP Electrochimica Acta, 55(28), 8527, 2010 |
| 8 |
An investigation of copper interconnect deposition bath ageing by electrochemical impedance spectroscopy Gabrielli C, Mocoteguy P, Perrot H, Nieto-Sanz D, Zdunek A Journal of Applied Electrochemistry, 38(4), 457, 2008 |
| 9 |
New formation process of plating thin films on several substrates by means of self-assembled monolayer (SAM) process Osaka T, Yoshino M Electrochimica Acta, 53(2), 271, 2007 |
| 10 |
A model for copper deposition in the damascene process Gabrielli C, Mocoteguy P, Perrot H, Nieto-Sanz D, Zdunek A Electrochimica Acta, 51(8-9), 1462, 2006 |