| 1 |
Evolution of stacking fault tetrahedral and work hardening effect in copper single crystals
Liu HT, Zhu XF, Sun YZ, Xie WK
Applied Surface Science, 422, 413, 2017 |
| 2 |
The influence of pH on the reduction of CO and CO2 to hydrocarbons on copper electrodes
Schouten KJP, Gallent EP, Koper MTM
Journal of Electroanalytical Chemistry, 716, 53, 2014 |
| 3 |
Structure and composition of Cu(hkl) surfaces exposed to O-2 and emersed from alkaline solutions: Prelude to UHV-EC studies of CO2 reduction at well-defined copper catalysts
Baricuatro JH, Ehlers CB, Cummins KD, Soriaga MP, Stickney JL, Kim YG
Journal of Electroanalytical Chemistry, 716, 101, 2014 |
| 4 |
Copper underpotential deposition on Ru quasi-single-crystal films
Bogolowski N, Huxter S, Abd-El-Latif AEAA, Attard GA, Baltruschat H
Journal of Electroanalytical Chemistry, 646(1-2), 68, 2010 |
| 5 |
Epitaxial growth of continuous CeO(2) (111) ultra-thin films on Cu(111)
Sutara F, Cabala M, Sedlacek L, Skala T, Skoda M, Matolin V, Prince KC, Chab V
Thin Solid Films, 516(18), 6120, 2008 |
| 6 |
The effect of the initial orientation on microstructure development of copper single crystals subjected to equal-channel angular pressing
Miyamoto H, Fushimi J, Mimaki T, Vinogradov A, Hashimoto S
Materials Science Forum, 503-504, 799, 2006 |
| 7 |
Infrared spectroscopic and voltammetric study of adsorbed CO on stepped surfaces of copper monocrystalline electrodes
Koga O, Teruya S, Matsuda K, Minami M, Hoshi N, Hori Y
Electrochimica Acta, 50(12), 2475, 2005 |
| 8 |
Deformation structure and crystal orientation of copper single crystals deformed by equal channel angular pressing
Miyamoto H, Erb U, Koyama T, Mimaki T, Vinogradov A, Hashimoto S
Materials Science Forum, 426-4, 2795, 2003 |
| 9 |
Steady-state surface stress induced in noble gas sputtering
Dahmen K, Giesen M, Ikonomov J, Starbova K, Ibach H
Thin Solid Films, 428(1-2), 6, 2003 |
| 10 |
Finite element analysis of characteristics of residual strains in cross-sectional specimens of strained-layer materials
Chen CR, Li SX
Journal of Materials Science, 35(5), 1145, 2000 |
