검색결과 : 12건
| No. | Article |
|---|---|
| 1 |
Numerical analysis of the reliability of photovoltaic modules based on the fatigue life of the copper interconnects Aly SP, Ahzi S, Barth N, Abdallah A Solar Energy, 212, 152, 2020 |
| 2 |
Evaluations of intrinsic time dependent dielectric breakdown of dielectric copper diffusion barriers Zhao L, Lofrano M, Croes K, Van Besien E, Tokei Z, Wilson CJ, Degraeve R, Kauerauf T, Beyer GP, Claeys C Thin Solid Films, 520(1), 662, 2011 |
| 3 |
Influence of incorporated non-metallic impurities on electromigration in copper damascene interconnect lines Stangl M, Liptak M, Acker J, Hoffmann V, Baunack S, Wetzig K Thin Solid Films, 517(8), 2687, 2009 |
| 4 |
ToF-SIMS imaging of Cl at Cu grain boundaries in interconnects for microelectronics Barnes JP, Carreau V, Maitrejean S Applied Surface Science, 255(4), 1564, 2008 |
| 5 |
Effect of liquid additives in supercritical fluid deposition of copper for enhancing deposition chemistry Momose T, Ohkubo T, Sugiyama M, Shimogaki Y Thin Solid Films, 517(2), 674, 2008 |
| 6 |
Characterization of post-copper CMP surfaces with scanning probe microscopy - Part 1: Surface leakage measurement with conductive atomic force microscopy Dominget A, Farkas J, Szunerits S Applied Surface Science, 252(22), 7760, 2006 |
| 7 |
Electroless copper deposition on silicon with titanium seed layer Aithal RK, Yenamandra S, Gunasekaran RA, Coane P, Varahramyan K Materials Chemistry and Physics, 98(1), 95, 2006 |
| 8 |
Effect of interface modification on EM-induced degradation mechanisms in copper interconnects Zschech E, Meyer MA, Mhaisalkar SG, Vairagar AV, Krishnamoorthy A, Engelmann HJ, Sukharev V Thin Solid Films, 504(1-2), 279, 2006 |
| 9 |
In-line monitoring of advanced microelectronic processes using combined X-ray techniques Wyon C, Delille D, Gonchond JP, Heider F, Kwakman L, Marthon S, Mazor I, Michallet A, Muyard D, Perino-Gallice L, Royer JC, Tokar A Thin Solid Films, 450(1), 84, 2004 |
| 10 |
Correlation between microstructure and barrier properties of TiN thin films used Cu interconnects Moriyama M, Kawazoe T, Tanaka M, Murakami M Thin Solid Films, 416(1-2), 136, 2002 |