검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
접합압연공정에 의해 제조된 AA1050/Mg(AZ91)/AA1050 복합판재의 미세조직 및 기계적 특성 이성희, 유효상, 임차용 Korean Journal of Materials Research, 26(3), 154, 2016 |
| 2 |
냉간압연접합법에 의해 제조된 AA1050/AA6061/AA1050 층상 복합판재의 미세조직 및 기계적 성질 안무종, 유효상, 이성희 Korean Journal of Materials Research, 26(7), 388, 2016 |
| 3 |
Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications Lin YC, Chen X Journal of Adhesion Science and Technology, 22(14), 1631, 2008 |
| 4 |
Study of hole-machining on pyren wafer by electrochemical discharge machining (ECDM) Liao YS, Peng WY Materials Science Forum, 505-507, 1207, 2006 |
| 5 |
Ultra grain refinement and high strengthening of Al based MMC Lee SH, Lee CH, Chang SY Materials Science Forum, 449-4, 613, 2004 |