검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Quantitative analysis of the mechanical robustness of multilayered bonding pad on a semiconductor device by nanoindentation and nanoscratch tests Shin DK, Im J Thin Solid Films, 531, 340, 2013 |
| 2 |
Novel pad structures for the improvement of wire bonding strength in DXD panel Choo KS, Kim KJ, Ahn BC Current Applied Physics, 2(3), 257, 2002 |