검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Effect of silicon nitride capping layer on via electromigration and failure criterion methodology in multilevel interconnection Huang JS, Deng XJ, Yih PH, Shofner TL, Obeng YS, Darling C Thin Solid Films, 397(1-2), 186, 2001 |
| 2 |
Residue-Free Reactive Ion Etching of Silicon-Carbide in Fluorinated Plasmas .2. 6H-SiC Yih PH, Steckl AJ Journal of the Electrochemical Society, 142(1), 312, 1995 |
| 3 |
Residue-Free Reactive Ion Etching of 3C-SiC and 6H-SiC in Fluorinated Mixture Plasmas Yih PH, Steckl AJ Journal of the Electrochemical Society, 142(8), 2853, 1995 |