검색결과 : 15건
| No. | Article |
|---|---|
| 1 |
Effect of concentric slanted pad groove patterns on slurry flow during chemical mechanical planarization Rosales-Yeomans D, Lee H, Suzuki T, Philipossian A Thin Solid Films, 520(6), 2224, 2012 |
| 2 |
Studying the effect of temperature on the copper oxidation process using hydrogen peroxide for use in multi-step chemical mechanical planarization models DeNardis D, Rosales-Yeomans D, Borucki L, Philipossian A Thin Solid Films, 518(14), 3903, 2010 |
| 3 |
A three-step copper chemical mechanical planarization model including the dissolution effects of a commercial slurry DeNardis D, Rosales-Yeomans D, Borucki L, Philipossian A Thin Solid Films, 518(14), 3910, 2010 |
| 4 |
Analysis of pads with slanted grooves for copper CMP Rosales-Yeomans D, DeNardis D, Borucki L, Suzuki T, Philipossian A Journal of the Electrochemical Society, 155(10), H750, 2008 |
| 5 |
Design and evaluation of pad grooves for copper CMP Rosales-Yeomans D, DeNardis D, Borucki L, Philipossian A Journal of the Electrochemical Society, 155(10), H797, 2008 |
| 6 |
Evaluation of pad groove designs under reduced slurry flow rate conditions during copper CMP Rosales-Yeomans D, DeNardis D, Borucki L, Suzuki T, Sampurno Y, Philipossian A Journal of the Electrochemical Society, 155(10), H812, 2008 |
| 7 |
Implications of wafer-size scale-up on frictional, thermal, and kinetic attributes of interlayer dielectric CMP process Rosales-Yeomans D, Borucki L, Doi T, Lujan L, Philipossian A Journal of the Electrochemical Society, 153(4), G272, 2006 |
| 8 |
Characterization of copper-hydrogen peroxide film growth kinetics DeNardis D, Rosales-Yeomans D, Borucki L, Philipossian A Thin Solid Films, 513(1-2), 311, 2006 |
| 9 |
Effect of pad groove designs on the frictional and removal rate characteristics of ILD CMP Rosales-Yeomans D, Doi T, Kinoshita M, Suzuki T, Philipossian A Journal of the Electrochemical Society, 152(1), G62, 2005 |
| 10 |
Small bodies of the solar system Yeomans D Nature, 404(6780), 829, 2000 |