검색결과 : 6건
| No. | Article |
|---|---|
| 1 |
Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnects Hsu KC, Perng DC, Yeh JB, Wang YC Applied Surface Science, 258(18), 7225, 2012 |
| 2 |
5 nm Amorphous Boron and Carbon Added Ru Film as a Highly Reliable Cu Diffusion Barrier Perng DC, Yeh JB, Hsu KC, Wang YC Electrochemical and Solid State Letters, 13(8), H290, 2010 |
| 3 |
Amorphous RuW Film as a Diffusion Barrier for Advanced Cu Metallization Yeh JB, Perng DC, Hsu KC Journal of the Electrochemical Society, 157(8), H810, 2010 |
| 4 |
Self-forming AlOx layer as Cu diffusion barrier on porous low-k film Perng DC, Yeh JB, Hsu KC, Tsai SW Thin Solid Films, 518(6), 1648, 2010 |
| 5 |
Ru/WCoCN as a seedless Cu barrier system for advanced Cu metallization Perng DC, Yeh JB, Hsu KC Applied Surface Science, 256(3), 688, 2009 |
| 6 |
Phosphorous doped Ru film for advanced Cu diffusion barriers Perng DC, Yeh JB, Hsu KC Applied Surface Science, 254(19), 6059, 2008 |