검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Development of a slurry employing a unique silica abrasive for the CMP of Cu Damascene structures Wrschka P, Hernandez J, Oehrlein GS, Negrych JA, Haag G, Rau P, Currie JE Journal of the Electrochemical Society, 148(6), G321, 2001 |
| 2 |
Surface chemistry studies of copper chemical mechanical planarization Hernandez J, Wrschka P, Oehrlein GS Journal of the Electrochemical Society, 148(7), G389, 2001 |
| 3 |
Chemical mechanical planarization of copper damascene structures Wrschka P, Hernandez J, Oehrlein GS, King J Journal of the Electrochemical Society, 147(2), 706, 2000 |
| 4 |
Polishing parameter dependencies and surface oxidation of chemical mechanical polishing of Al thin films Wrschka P, Hernandez J, Hsu Y, Kuan TS, Oehrlein GS, Sun HJ, Hansen DA, King J, Fury MA Journal of the Electrochemical Society, 146(7), 2689, 1999 |
| 5 |
Chemical mechanical polishing of Al and SiO2 thin films: The role of consumables Hernandez J, Wrschka P, Hsu Y, Kuan TS, Oehrlein GS, Sun HJ, Hansen DA, King J, Fury MA Journal of the Electrochemical Society, 146(12), 4647, 1999 |