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| No. | Article |
|---|---|
| 1 |
Characterization of WF6/N-2/H-2 plasma enhanced chemical vapor deposited WxN films as barriers for Cu metallization Li H, Jin S, Bender H, Lanckmans F, Heyvaert I, Maex K, Froyen L Journal of Vacuum Science & Technology B, 18(1), 242, 2000 |