| 1 |
Liquid clean formulations for stripping high-dose ion-implanted photoresist from microelectronic devices
Visintin PM, Korzenski MB, Baum TH
Journal of the Electrochemical Society, 153(7), G591, 2006 |
| 2 |
Studies on CO2-based slurries and fluorinated silica and alumina particles for chemical mechanical polishing of copper films
Visintin PM, Eichenlaub SK, Portnow LE, Carbonell RG, Beaudoin SP, Schauer CK, DeSimone JM
Journal of the Electrochemical Society, 153(12), G1064, 2006 |
| 3 |
Oxidative dissolution of copper and zinc metal in carbon dioxide with tert-butyl peracetate and a beta-diketone chelating agent
Visintin PM, Bessel CA, White PS, Schauer CK, DeSimone JM
Inorganic Chemistry, 44(2), 316, 2005 |
| 4 |
Chemical functionalization of silica and alumina particles for dispersion in carbon dioxide
Visintin PM, Carbonell RG, Schauer CK, DeSimone JM
Langmuir, 21(11), 4816, 2005 |
| 5 |
Etchant solutions for the removal of Cu(0) in a supercritical CO2-based "dry" chemical mechanical planarization process for device fabrication
Bessel CA, Denison GM, DeSimone JM, DeYoung J, Gross S, Schauer CK, Visintin PM
Journal of the American Chemical Society, 125(17), 4980, 2003 |
