검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Circular and rectangular via holes formed in SiC via using ArF based UV excimer laser Liu L, Chang CY, Wu WH, Pearton SJ, Ren F Applied Surface Science, 257(6), 2303, 2011 |
| 2 |
Micro via and line patterning for PCB using imprint technique Ra S, Lee C, Cho J, Lee S, Lee J, Hong M, Kwak J Current Applied Physics, 8(6), 675, 2008 |
| 3 |
Analysis of materials modifications caused by UV laser micro drilling of via holes in AlGaN/GaN transistors on SiC Wernicke T, Kruger O, Herms M, Wurfl J, Neumann W, Behm T, Irmer G, Trankle G Applied Surface Science, 253(19), 8008, 2007 |
| 4 |
Plating technology for electronics packaging Honma H Electrochimica Acta, 47(1-2), 75, 2001 |