| 1 |
Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach
Bozsoki I, Geczy A, Illes B
International Journal of Heat and Mass Transfer, 128, 562, 2019 |
| 2 |
Numerical investigation on the effect of condensate layer formation around large-size components during vapour phase soldering
Illes B, Geczy A, Krammer O, Dusek K, Busek D
International Journal of Heat and Mass Transfer, 125, 202, 2018 |
| 3 |
Investigating heat transfer coefficient differences on printed circuit boards during vapour phase reflow soldering
Geczy A
International Journal of Heat and Mass Transfer, 109, 167, 2017 |
| 4 |
Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system
Illes B, Skwarek A, Geczy A, Krammer O, Busek D
International Journal of Heat and Mass Transfer, 114, 613, 2017 |
| 5 |
Investigating condensation heat transfer during vapour phase soldering on round-shaped PCB plates
Geczy A, Illes B, Darnai T
International Journal of Heat and Mass Transfer, 86, 639, 2015 |
| 6 |
Modeling method of heat transfer during Vapour Phase Soldering based on filmwise condensation theory
Geczy A, Illes B, Illyefalvi-Vitez Z
International Journal of Heat and Mass Transfer, 67, 1145, 2013 |
