검색결과 : 7건
| No. | Article |
|---|---|
| 1 |
Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu Okoro C, Labie R, Vanstreels K, Franquet A, Gonzalez M, Vandevelde B, Beyne E, Vandepitte D, Verlinden B Journal of Materials Science, 46(11), 3868, 2011 |
| 2 |
Removal of High-Dose Ion-Implanted 248 nm Deep UV Photoresist Using UV Irradiation and Organic Solvent Tsvetanova D, Vos R, Vanstreels K, Radisic D, Sonnemans R, Berry I, Waldfried C, Mattson D, DeLuca J, Vereecke G, Mertens PW, Parac-Vogt TN, Heyns MM Journal of the Electrochemical Society, 158(2), H150, 2011 |
| 3 |
Degradation of 248 nm Deep UV Photoresist by Ion Implantation Tsvetanova D, Vos R, Vereecke G, Parac-Vogt TN, Clemente F, Vanstreels K, Radisic D, Conard T, Franquet A, Jivanescu M, Nguyen DAP, Stesmans A, Brijs B, Mertens P, Heyns MM Journal of the Electrochemical Society, 158(8), H785, 2011 |
| 4 |
Nanoindentation study of thin plasma enhanced chemical vapor deposition SiCOH low-k films modified in He/H-2 downstream plasma Vanstreels K, Urbanowicz AM Journal of Vacuum Science & Technology B, 28(1), 173, 2010 |
| 5 |
Analysis and modeling of the high vacuum scanning spreading resistance microscopy nanocontact on silicon Eyben P, Clemente F, Vanstreels K, Pourtois G, Clarysse T, Duriau E, Hantschel T, Sankaran K, Mody J, Vandervorst W, Mylvaganam K, Zhang LC Journal of Vacuum Science & Technology B, 28(2), 401, 2010 |
| 6 |
Effect of Porogen Residue on Chemical, Optical, and Mechanical Properties of CVD SiCOH Low-k Materials Urbanowicz AM, Vanstreels K, Shamiryan D, De Gendt S, Baklanova MR Electrochemical and Solid State Letters, 12(8), H292, 2009 |
| 7 |
Copper deposition and subsequent grain structure evolution in narrow lines Brongersma SH, D'Haen J, Vanstreels K, DeCeuninck W, Vervoort I, Maex K Materials Science Forum, 426-4, 2485, 2003 |