검색결과 : 8건
| No. | Article |
|---|---|
| 1 |
Effect of ultraviolet curing wavelength on low-k dielectric material properties and plasma damage resistance Marsik P, Urbanowicz AM, Verdonck P, De Roest D, Sprey H, Baklanov MR Thin Solid Films, 519(11), 3619, 2011 |
| 2 |
Effects of He Plasma Pretreatment on Low-k Damage during Cu Surface Cleaning with NH3 Plasma Urbanowicz AM, Shamiryan D, Zaka A, Verdonck P, De Gendt S, Baklanov MR Journal of the Electrochemical Society, 157(5), H565, 2010 |
| 3 |
Nanoindentation study of thin plasma enhanced chemical vapor deposition SiCOH low-k films modified in He/H-2 downstream plasma Vanstreels K, Urbanowicz AM Journal of Vacuum Science & Technology B, 28(1), 173, 2010 |
| 4 |
Effect of energetic ions on plasma damage of porous SiCOH low-k materials Kunnen E, Baklanov MR, Franquet A, Shamiryan D, Rakhimova TV, Urbanowicz AM, Struyf H, Boullart W Journal of Vacuum Science & Technology B, 28(3), 450, 2010 |
| 5 |
Effect of Porogen Residue on Chemical, Optical, and Mechanical Properties of CVD SiCOH Low-k Materials Urbanowicz AM, Vanstreels K, Shamiryan D, De Gendt S, Baklanova MR Electrochemical and Solid State Letters, 12(8), H292, 2009 |
| 6 |
Ultraviolet-assisted curing of organosilicate glass low-k dielectric by excimer lamps Eslava S, Iacopi F, Urbanowicz AM, Kirschhock CEA, Maex K, Martens JA, Baklanov MR Journal of the Electrochemical Society, 155(11), G231, 2008 |
| 7 |
Damage reduction and sealing of low-k films by combined He and NH3 plasma treatment Urbanowicz AM, Baklanov MR, Heijlen J, Travaly Y, Cockburn A Electrochemical and Solid State Letters, 10(10), G76, 2007 |
| 8 |
Damage reduction and sealing of low-k films by combined He and NH3 plasma treatment (vol 10, pg G76, 2007) Urbanowicz AM, Baklanov MR, Heijlen J, Travaly Y, Cockburn A Electrochemical and Solid State Letters, 10(11), S7, 2007 |