검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Growth kinetics of copper chemical vapor deposition and trench filling without a seed layer Tze JJ, Tsai DS Journal of the Chinese Institute of Chemical Engineers, 37(2), 177, 2006 |
| 2 |
Influence of surface additives iodine and indium on the initial growth in copper chemical vapor deposition Chang TY, Tze JJ, Tsai DS Applied Surface Science, 236(1-4), 165, 2004 |