화학공학소재연구정보센터
검색결과 : 4건
No. Article
1 Investigation into the effects of magnetic agitation and pulsed current on the development of Sn-Cu alloy electrodeposits
Wu L, Cobley AJ
Thin Solid Films, 683, 118, 2019
2 Thin film metallic glass as an underlayer for tin whisker mitigation: A room-temperature evaluation
Diyatmika W, Chu JP, Yen YW, Chang WZ, Hsueh CH
Thin Solid Films, 561, 93, 2014
3 Imposition of defined states of stress on thin films by a wafer-curvature method; validation and application to aging Sn films
Stein J, Pascher M, Welzel U, Huegel W, Mittemeijer EJ
Thin Solid Films, 568, 52, 2014
4 Whisker growth from tin coatings
Hutchinson B, Oliver J, Nylen M, Hagstrom J
Materials Science Forum, 467-470, 465, 2004