| 1 |
Time to failure modeling of silver nanowire transparent conducting electrodes and effects of a reduced graphene oxide over layer
Kwan YCG, Le QL, Huan CHA
Solar Energy Materials and Solar Cells, 144, 102, 2016 |
| 2 |
Analysis of the Kinetics of Electrochemical Migration on Printed Circuit Boards Using Nernst-Planck Transport Equation
He XF, Azarian MH, Pecht MG
Electrochimica Acta, 142, 1, 2014 |
| 3 |
API Standard 521 new alternative method to evaluate fire relief for pressure relief device sizing and depressuring system design
Zamejc E
Journal of Loss Prevention in The Process Industries, 27, 21, 2014 |
| 4 |
Failure in a soft gel: Delayed failure and the dynamic yield stress
Brenner T, Matsukawa S, Nishinari K, Johannsson R
Journal of Non-Newtonian Fluid Mechanics, 196, 1, 2013 |
| 5 |
Validation of Spring Operated Pressure Relief Valve Time-to-Failure
Harris SP, Gross RE
Process Safety Progress, 29(1), 55, 2010 |
| 6 |
Skin effect of on-chip copper interconnects on electromigration
Wu W, Yuan JS
Solid-State Electronics, 46(12), 2269, 2002 |
| 7 |
Electromigration subjected to Joule heating under pulsed DC stress
Wu W, Yuan JS, Kang SH, Oates AS
Solid-State Electronics, 45(12), 2051, 2001 |
