검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Elimination of surface scratch/texture on the surface of single crystal Si substrate in chemo-mechanical grinding (CMG) process Tian YB, Zhou L, Shimizu J, Tashiro Y, Kang RK Applied Surface Science, 255(7), 4205, 2009 |
| 2 |
Modeling and analyzing on nonuniformity of material removal in chemical mechanical polishing of silicon wafer Su J, Guo DM, Kang RK, Jin ZJ, Li XJ, Tian YB Materials Science Forum, 471-472, 26, 2004 |
| 3 |
Investigation on material removal rate in rotation grinding for large-scale silicon wafer Tian YB, Kang RK, Guo DM, Jin ZJ, Su JX Materials Science Forum, 471-472, 362, 2004 |
| 4 |
Two-photon absorption spectra of new organic compounds Lei H, Huang ZL, Wang HZ, Tang XJ, Wu LZ, Zhou GY, Wang D, Tian YB Chemical Physics Letters, 352(3-4), 240, 2002 |