| 1 |
Homogeneity and penetration depth of atmospheric pressure plasma polymerization onto electrospun nanofibrous mats
Michlicek M, Manakhova A, Dvorakova E, Zajickova L
Applied Surface Science, 471, 835, 2019 |
| 2 |
Electrical and chemical characterizations of hafnium (IV) oxide films for biological lab-on-a-chip devices
Collins JL, Hernandez HM, Habibi S, Kendrick CE, Wang Z, Bihari N, Bergstrom PL, Minerick AR
Thin Solid Films, 662, 60, 2018 |
| 3 |
Fabrication and Characterization of Cytochrome C Modified Poly(3-Aminobenzoic Acid) Thin Film
Sriwichai S, Niroj S, Phanichphant S
Molecular Crystals and Liquid Crystals, 621(1), 142, 2015 |
| 4 |
A study on properties of yttrium-stabilized zirconia thin films fabricated by different deposition techniques
Paek JY, Chang I, Park JH, Ji S, Cha SW
Renewable Energy, 65, 202, 2014 |
| 5 |
Improvement of process parameters for polycrystalline silicon carbide low pressure chemical vapor deposition on 150 mm silicon substrate using monomethylsilane as precursor
Ajayakumar A, Maruthoor S, Fuchs T, Rohlfing F, Jakovlev O, Wilde J, Reinecke H
Thin Solid Films, 536, 94, 2013 |
| 6 |
Effect of near-substrate plasma density in the reactive magnetron sputter deposition of hydrogenated amorphous germanium
Kaufman-Osborn T, Pollock KM, Hiltrop J, Braam K, Fazzio S, Doyle JR
Thin Solid Films, 520(6), 1866, 2012 |
| 7 |
Preparation and characterization of TiO2/carbon composite thin films with enhanced photocatalytic activity
Sellappan R, Zhu JF, Fredriksson H, Martins RS, Zach M, Chakarov D
Journal of Molecular Catalysis A-Chemical, 335(1-2), 136, 2011 |
| 8 |
Self-assembled film thickness determination by focused ion beam
Dejeu J, Salut R, Spajer M, Membrey F, Foissy A, Charraut D
Applied Surface Science, 254(17), 5506, 2008 |
| 9 |
Analysis of defects in epitaxial oxide thin films via X-ray diffraction technology
Hollmann E, Wordenweber R
Thin Solid Films, 515(7-8), 3530, 2007 |
| 10 |
Oxide and nitride thin films: Processing and characterization
Chen H
Materials Science Forum, 437-4, 193, 2003 |
