검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Tribological, Thermal and Kinetic Attributes of 300 vs. 450 mm Chemical Mechanical Planarization Processes Jiao YB, Liao XY, Wu CH, Theng S, Zhuang Y, Sampurno Y, Goldstein M, Philipossian A Journal of the Electrochemical Society, 159(3), H255, 2012 |
| 2 |
Effect of Pad Surface Micro-Texture on Coefficient of Friction and Removal Rate during Copper CMP Process Liao X, Zhuang Y, Borucki LJ, Theng S, Wei X, Ashizawa T, Philipossian A Electrochemical and Solid State Letters, 14(5), H201, 2011 |