검색결과 : 6건
| No. | Article |
|---|---|
| 1 |
Effects of Electroplating at Lower Leveler and Suppressor Contents on the Formation of Very Low Resistivity Narrow Cu Interconnects Miyamoto R, Tamahashi K, Inami T, Sasajima Y, Onuki J Journal of the Electrochemical Society, 166(4), D137, 2019 |
| 2 |
Impact of Electroplating at Lower Leveler Content on the Formation of Low Resistivity Narrow Cu Interconnects Inami T, Miyamoto R, Tamahashi K, Namekawa T, Ishikawa N, Ito M, Onuki J Journal of the Electrochemical Society, 164(7), D505, 2017 |
| 3 |
Screening of Undesirable Elements Raising the Electrical Resistivity in Very Narrow Cu Wires by Ab Initio Calculation Nagano T, Tamahashi K, Inami T, Sasajima Y, Onuki J Journal of the Electrochemical Society, 164(9), D558, 2017 |
| 4 |
Resistivity Reduction in Very Narrow Cu Wiring Onuki J, Sasajima Y, Tamahashi K, Ke YQ, Terada S, Hidaka K, Itoh S Journal of the Electrochemical Society, 160(12), D3266, 2013 |
| 5 |
Electron backscatter diffraction analysis of electrodeposited nano-scale copper wires Ke Y, Konkova T, Mironov S, Tamahashi K, Onuki J Thin Solid Films, 539, 207, 2013 |
| 6 |
Substrate temperature dependence of electrical and structural properties of Ru films Nagano T, Inokuchi K, Tamahashi K, Ishikawa N, Sasajima Y, Onuki J Thin Solid Films, 520(1), 374, 2011 |