검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Highly thermostable joint of a Cu/Ni-P plating/Sn-0.7Cu solder added with Cu balls Kadoguchi T, Take N, Yamanaka K, Nagao S, Suganuma K Journal of Materials Science, 52(6), 3244, 2017 |
| No. | Article |
|---|---|
| 1 |
Highly thermostable joint of a Cu/Ni-P plating/Sn-0.7Cu solder added with Cu balls Kadoguchi T, Take N, Yamanaka K, Nagao S, Suganuma K Journal of Materials Science, 52(6), 3244, 2017 |