| 1 |
Working mechanism of iodide ions and its application to Cu microstructure control in through silicon via filling
Sung M, Kim SH, Lee HJ, Lim T, Kim JJ
Electrochimica Acta, 295, 224, 2019 |
| 2 |
Outdoor thermal comfort and summer PET range: A field study in tropical city Dhaka
Sharmin T, Steemers K, Humphreys M
Energy and Buildings, 198, 149, 2019 |
| 3 |
Activation of amino-based monolayers for electroless metallization of high-aspect-ratio through-silicon vias by using a simple ultrasonic-assisted plating solution
Chen ST, Cheng YS, Chang YH, Yang TM, Lee JT, Chen GS
Applied Surface Science, 440, 209, 2018 |
| 4 |
Estimated thermal sensation models by physiological parameters during wind chill stimulation in the indoor environment
Cheng CC, Lee D, Huang BS
Energy and Buildings, 172, 337, 2018 |
| 5 |
Impact of urban morphology on microclimate and thermal comfort in northern China
Tong SS, Wong NH, Tan CL, Jusuf SK, Ignatius M, Tan EN
Solar Energy, 155, 212, 2017 |
| 6 |
Extreme fast filling of conical shape through-silicon vias in 3 minutes and additive optimization
Ha HV, Kondo K
Electrochimica Acta, 212, 270, 2016 |
| 7 |
Field study on the objective evaluation of sleep quality and sleeping thermal environment in summer
Zhu ML, Ouyang Q, Shen HG, Zhu YX
Energy and Buildings, 133, 843, 2016 |
| 8 |
구리 전해 도금을 이용한 실리콘 관통 비아 채움 공정
김회철, 김재정
Korean Chemical Engineering Research, 54(6), 723, 2016 |
| 9 |
Galvanostatic bottom-up filling of TSV-like trenches: Choline-based leveler containing two quaternary ammoniums
Kim MJ, Seo Y, Kim HC, Lee Y, Choe S, Kim YG, Cho SK, Kim JJ
Electrochimica Acta, 163, 174, 2015 |
| 10 |
Thermal comfort assessment of large-scale hospitals in tropical climates: A case study of University Kebangsaan Malaysia Medical Centre (UKMMC)
Azizpour F, Moghimi S, Salleh E, Mat S, Lim CH, Sopian K
Energy and Buildings, 64, 317, 2013 |
